Some Surfactant Effect on the Electropolishing of Copper in H3PO4 Acid Compulsory Convection Circumstances: Agitated Vessel

Abstract

Copper electro-dissolution in phosphoric acid is investigated in different surfactant concentrations (Triton -x100, SAS, and CPC). The results reveal that surfactants have strong retardation behavior. Copper dissolution behavior in SAS-containing solution was examined beneath an agitated vessel using an impeller as compulsory convection. The limiting current increases with increasing rotation, which indicates that the anodic dissolution is a diffusion-controlled process. The limiting current was reduced by raising the SAS concentration and amplifying the temperature from 293 -313 K. The activation energy values established the reaction rate, which was controlled via diffusion. The data in different instances was commanded through dimensionless correlations of Sherwood (Sh), Schmidt (Sc), and Reynolds (Re) numbers.